Weeroc Turnkey IC design solution will accompany our clients from the conceptual phase up to industrialization, in 6 steps
We will help you to bring up your ideas quickly with your Proof-of-Concept. Your POC could based on simulations, or hardware based on our COTs or commercial FPGAs.
We establish specifications with customer, work on the planning, pricing, distribution agreement and others. During this phase we work closely with our customer technical team
We design your product and update clients based on the agreed milestones. The works starts from design entry and HDL coding up to chip sign-off simulations. Upon client agreement, we will send out fabrication files for tapeout
During the Silicon Manufacturing phase, Weeroc will act the interface between customer and the foundry. Weeroc is able to cater MPW, MLM or engineering run and interfacing with foundries such as TSMC, Microchip, X-Fab, STMicroelectronics or AMS. In Assembly phase, Weeroc will handle packaging service such as Bonding diagram, package substrate design and Weeroc is capable to offer various type of packages through various packaging partner. Additionally, Weeroc has partnership with qualified packaging line and also high volume packaging companies.
We will develop specific hardware and software for characterizing the IC prototype. Detailed evaluation report is also provided in order to the verify the performances of the fabricated IC.
Weeroc will help customers in Industrialization Phase where our technical will help setting up ATE test, ESD and additional qualification. The transfer to volume production will also be assured by our technical team. Weeroc could also provide complete Supply Chain Management, by handling customer order and management of subcontractor. Additionally, the management of component obsolescence and longevity of supply can also be assured by Weeroc
